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Established Dongyang Circuit to produce high-precision PCBs
Obtained ISO14001 and ISO9001 certifications successively
Equipment updates achieve fully automated production, with monthly production capacity exceeding 10000
Established the Soft Hard Integration Business Unit in 2020 to explore overseas markets
Repositioning the layout towards the development of high rise, fast board, and batch board
Annual output value exceeds 100 million yuan, monthly output exceeds 20000 square meters
After the expansion of the factory in 2023, the process will be relocated to Building F7 in the northern industrial park to achieve capacity upgrading
By 2025, the Metal Substrate Division will be established, specializing in providing copper substrates for thermoelectric meters in the medical and automotive fields, ultra-high thermal conductivity substrates, copper aluminum composites, and high-rise thermoelectric meter copper substrates
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